Banner
Home      Log In      Contacts      FAQs      INSTICC Portal
 
Documents
SIMULTECH 2014 will be held in conjunction with ICETE 2014, ICSOFT 2014 and DATA 2014.
Registration to SIMULTECH allows free access to the ICETE, ICSOFT and DATA conferences (as a non-speaker).

 
The purpose of the 4th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH) is to bring together researchers, engineers, applied mathematicians and practitioners interested in the advances and applications in the field of system simulation. Four simultaneous tracks will be held, covering on one side domain independent methodologies and technologies and on the other side practical work developed in specific application areas. The specific topics listed under each of these tracks highlight the interest of this conference in aspects related to computing, including Conceptual Modeling, Agent Based Modeling and Simulation, Interoperability, Ontologies, Knowledge Based Decision Support, Petri Nets, Business Process Modeling and Simulation, amongst others.




Conference Chair

Mohammad S. ObaidatFordham University, NY, United States

PROGRAM CO-CHAIRS

Janusz KacprzykPolish Academy of Sciences, Poland
Tuncer Ören (honorary)University of Ottawa, Canada

Keynote Speakers

Bernard P.ZeiglerUniversity of Arizona, United States
Paul FishwickUniversity of Texas at Dallas, United States
Helena SzczerbickaUniversität Hannover, Germany

Doctoral Consortium

Chair: Tuncer Ören
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


A short list of presented papers will be selected
so that revised and extended versions of these
papers will be published by Springer-Verlag in a
Advances in Intelligent Systems and Computing
Series book

Technically Co-sponsored by:

SCS   Liophant Simulation   Simulation Team   IEEE CS   IEEE CS - TCSIM  


In Cooperation with:

ACM In-Cooperation 
  MIMOS   JSST   ASIASIM   AIS SIGMAS  
ACM SIGMIS (novo)   ACM SIGSIM  
 


Proceedings will be submitted for indexation by:

Thomson   INSPEC   DBLP   EI   SCOPUS
footer